Chemtronics 40-1-5 - Soder-Wick Lead-Free Braid SD w/SD Bobbin - 5' - #1 White 0.030"/0.8 mm - 25 bobbins in Performance Pak

The Chemtronics 40-1-5 Soder-Wick Lead-Free Braid SD w/SD Bobbin is specially designed for the removal of today’s high temperature lead-free solders and uses state of the art desoldering technology. It has a single-layer weave used for Soder-Wick Lead-Free braid is lighter in mass and responds faster than any other conventional desoldering braid. The unique design of the Chemtronics 40-1-5 Soder-Wick Lead-Free Braid SD w/SD Bobbin minimizes overheating and requires less contact time preventing heat damage to the PCB sensitive components. This desoldering braid can also be used with Tin/Lead solders and will not leave ionic contamination on the boards. The Chemtronics 40-1-5 is especially effective at removing residual solder from SMT pads and is RoHS compliant. It also meets MIL-F-14256 F, NASA-STD-8739.3 Soldered Electrical Connections, DOD-STD-883E method 2022, ANSI/IPC STD-004 Type ROL0.

Benefits & Features of the Chemtronics 40-1-5 Soder-Wick Lead-Free Braid SD w/SD Bobbin:

• State of the art desoldering technology
• Specially designed for removal of today’s high temperature lead-free solders
• Single layer weave used for Soder-Wick lead-free braid is lighter in mass than any other desoldering braid
• Responds faster than any other conventional desoldering braid
• Unique design minimizes overheating and requires less contact time thus preventing heat damage to the PCB sensitive component
• Can also be used with Tin/Lead solders
• Non-corrosive ultra high purity no-clean flux
• Will not leave ionic contamination on the boards
• Especially effective at removing residual solder from SMT pads
• RoHS compliant
• Patent pending
• Meets MIL-F-14256 F, NASA-STD-8739.3 Soldered Electrical Connections, DOD-STD-883E Method 2022, ANSI/IPC STD-004 Type ROL0

0.30"x5' Solder-Wick,Lead-Free Desoldering Braid, White